Vulcanio is a high-throughput wet bench for under-bump metallization (Ni, Pd, Au) on Al- and Cu-based wafers up to 300mm. Designed for electroless plating, it ensures exceptional deposition uniformity, bath longevity, and low operating costs. Fully automated, it supports FOUP/SMIF systems and processes 25 or 50 wafer batches. With advanced process control, extensive documentation, and compliance with industry standards (FM 4910, SEMI S2/S8, SECS, GEM, CE), Vulcanio has been a trusted solution for semiconductor manufacturers since 2009