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Vulcanio

About Vulcanio

Vulcanio is a high-throughput wet bench for under-bump metallization (Ni, Pd, Au) on Al- and Cu-based wafers up to 300mm. Designed for electroless plating, it ensures exceptional deposition uniformity, bath longevity, and low operating costs. Fully automated, it supports FOUP/SMIF systems and processes 25 or 50 wafer batches. With advanced process control, extensive documentation, and compliance with industry standards (FM 4910, SEMI S2/S8, SECS, GEM, CE), Vulcanio has been a trusted solution for semiconductor manufacturers since 2009

Get in Touch

HQ Address:       Tel: +603 80118663

29, JALAN INDUSTRI

USJ1/13, TAMAN

PERINDUSTRIAN USJ 1,

47600 SUBANG JAYA,

SELANGOR. MALAYSIA

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Kulim Office:      Tel: +604 4102219

LOT 11, KHTP ADMIN

CENTRE, KULIM HI-TECH

PARK, 09000 KULIM

KEDAH.MALAYSIA

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Kuching Office:   Tel: +608 2366622

NO. 329, LOT 6655,

TABUAN LARU

COMMERCIAL CENTRE,

93350 KUCHING,

SARAWAK. MALAYSIA

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Penang Office:   Tel: +6045838524

NO. 9, LORONG

VALDOR JAYA 3,

GOLDEN GATEWAY

PERINDUSTRIAN VALDOR,

14200 SUNGAI JAWI,

PENANG, MALAYSIA

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