The NID dryer ensures fast, uniform, and energy-efficient wafer drying in semiconductor production. It handles substrates up to 12" and wafer thicknesses from 120 to 2000 µm. With low IPA consumption (≤30 ml/run), it supports IPA and N2 drying, offers high reliability (MTBF ≥ 800 h), and integrates into wet process benches.