The fully automated NexAStep platform delivers high-throughput wet cleaning and etching with a modular, compact design for maximum yield. It features wafer-friendly transport, fast processing, and optimized cleanroom use. With up to 75 storage spaces, high-speed DIW flow (80 l/min), and temperatures up to 170°C, it ensures efficiency. Low maintenance, intelligent safety controls, and flexible configuration enhance reliability and performance for 8″ Si, SiC, and GaN wafers.